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Samsung's advanced chip packaging tech I-Cube4

General 11:42 May 06, 2021
Samsung's advanced chip packaging tech I-Cube4
Samsung's advanced chip packaging tech I-Cube4

This photo, released by Samsung Electronics Co. on May 6, 2021, shows an advanced chip packaging technology for high-performance applications, Interposer-Cube4 (I-Cube4), which the company has developed. (PHOTO NOT FOR SALE) (Yonhap)
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General 11:42 May 06, 2021
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